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        Automotive Electronics

        ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

        AD8312 Plus Series

        Automatic Die Bonding System (12” wafer handling)

        Eagle AERO

        For High-end IC Applications

        Misc

        eClip Plus Series

        Automatic Clip Bonding System

        FIREBIRD TCB Series

        Automatic Thermal Compression Bonding System

        Ultrasonic Wedge Bonder

        HERCULES

        Heavy Aluminum Wire Bonding System

        Transfer Molding

        IDEALmold? 3G

        Automatic Encapsulation Solution (strip / reel form substrate handling)

        ISLinDA

        Automatic Die Bonding System (12” wafer handling)

        MP-TAB Series

        Automatic Trim & Form System

        NUCLEUS Series / NUCLEUS-XL Series

        Multi-Purpose Precision Pick & Place Tool

        20 Pickheads System

        SUNBIRD

        Fully Automatic Turret Sorting Handler

        AD832i

        Automatic Die Bonding System (8” wafer handling)

        Laser 1205

        UV Dicing System

        Other Applications

        丁香婷婷