<track id="jst1d"><div id="jst1d"></div></track>
    1. <track id="jst1d"></track>

      <menuitem id="jst1d"><dfn id="jst1d"><thead id="jst1d"></thead></dfn></menuitem>

      <track id="jst1d"></track>
      <track id="jst1d"><span id="jst1d"></span></track>

        LEDs

        ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

        Aluminium Bonder Ultrasonic Wedge Bonder

        AB589 Series

        Rotary Head Fine Aluminum Wire Bonding System

        AD211 Plus II

        Automatic Direct Eutectic Die Attach System

        AD838L-G2

        Automatic Die Attach System

        Wafer Form

        AS410

        Automatic Chip Probing System

        Wafer to Tape & Reel

        AT420

        Automatic LED Taping System

        Eagle AERO

        For High-end IC Applications

        LS100-2

        Automatic Laser Scribing System

        Wafer Form

        MS60

        Automatic Map Sorting System

        AD100

        High Speed Epoxy Die Bonder (for Vertical LED Application)

        AD210 Plus

        Automatic Die Bonding System (6” wafer handling)

        AD830 Plus

        Automatic Epoxy Die Attach System (6” wafer handling)

        AD830P-Plus

        Automatic Die Bonder

        Other Applications

        丁香婷婷