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        MEMs

        ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

        AD8312 Plus Series

        Automatic Die Bonding System (12” wafer handling)

        Eagle AERO

        For High-end IC Applications

        Transfer Molding

        IDEALmold? 3G

        Automatic Encapsulation Solution (strip / reel form substrate handling)

        Transfer Molding Compression Molding

        ORCAS Manual

        Manual Encapsulation Solution

        Compression Molding

        ORCAS Series

        Encapsulation Solution for Large Format Packaging

        Ball Bonder IC Wire Bonding Equipment

        Eagle Xpress GoCu

        High Speed Wire Bonder for Wider Substrate

        Special Wire Bonding Equipment

        Eagle Xpress GoCu with Automated Conveyor System

        High Speed Wire Bonder for Inline Configuration

        Ball Bonder OPTO/LED Wire Bonding Equipment

        Harrier Xtreme

        Dual-Head Extreme High Speed Wire Bonder

        Compression Molding

        IDEALcompress?

        Automatic Encapsulation Solution (strip form substrate handling)

        Transfer Molding

        IDEALmold? R2R

        Encapsulation Solution

        Ball Bonder IC Wire Bonding Equipment

        iHawk Xpress Gocu

        Wire Bonder

        OPTO/LED Wire Bonding Equipment

        iHawk Xpress XL

        Wire Bonder

        Other Applications

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