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        Advanced Packaging Solutions

        ASMPT's complete portfolio of wafer level and panel level packaging technologies, ranges from pick & place to large format mold, stencil print, ball drop, singulation and test & finish.

        • Pick n Place
        • Molding
        • Stencil Printing
        • Ball Drop
        • Singulation
        • WLP Inspection, Testing & Packaging
        丁香婷婷